CAC850G002
Product Description &Features
• Customized 850nm Vertical-Cavity Surface-Emitting Laser
• Very low wavelength-temperature sensitivity
• Chip on submount or heatsink is available upon request
• Other wavelengths, chip dimensions, and emitter patterns are available uponrequest
Typical Applications
• 3D sensing.
Electro-Optical Characteristics
Parameters | Symbol | Min | Typical | Max | Units | Test Condition |
Optical Output Power | Pop | 2.6 | 3.0 | – | W | Pulse 3.5A, 50℃ |
Threshold Current | Lth | – | 0.80 | 1.2 | A | Pulse 50℃ |
Operating Current | Lop | – | 3.5 | – | A | Pulse 3.5A, 50℃ |
Differential resistance | Rs | – | 0.11 | 0.20 | Ω | Pulse 3.5A, 50℃ |
Operating Voltage | Vop | 1.7 | 2.0 | 2.3 | V | Pulse 3.5A, 50℃ |
Slope Efficiency | ηs | 0.9 | 1.0 | – | W/A | Pulse 3.5A, 50℃ |
Power Conversion Efficiency | PCE | 37 | 41 | – | % | Pulse 3.5A, 50℃ |
Wavelength | λpeak | 840 | 850 | 860 | nm | Pulse 3.5A, 50℃ |
Spectral Width (RMS) | Δλ | – | 1 | 2.5 | nm | Pulse 3.5A, 50℃ |
Beam Full Divergence (D86) | ϕ | 19 | 23 | 27 | ° | Pulse 3.5A, 50℃ |
Wavelength coefficient | dλ/dT | – | 0.07 | – | nm/°C | Pulse 3.5A |
* All tests are under pulse condition on 1000Hz, 10%D.C. with heatsink temperature 50℃, unless otherwise specified.
Typical Performance Curves at 25°C
Mechanical Characteristics
| Parameter | Ratings | Units |
| Number of emitters | 560 | # |
| Emitter pitch(x) | 30 | µm |
| Emitter pitch(y) | 52 | µm |
| Chip Width | 855±15(Front); 865±20(Rear) | µm |
| Chip Length | 955±15(Front); 965±20(Rear); | µm |
| Chip Height | 100±10 | µm |
| Anode Contact | Emission side, Ausurface | / |
| Anode bonding | 100 X870, 100 X770 | µm x µm |
| Cathode Contact | Backside, Au surface | / |
Chip dimension layout
Absolute Maximum Rating
| Parameter | Conditions | Units |
| Operating Temperature | 0 to 85 | °C |
| Storage Temperature | -40 to 105 | °C |
Stresses beyond the parameters listed under Absolute Maxim Ratings may cause permanent damage to the chips.
Shipping Instruction
The modules are shipped in tape & reeling packaging or Gel-boxes.
Note: No responsibility is assumed for the use of these products. The products canemit Class IV radiation and must be operated with extreme care. Avoid directly viewing the laser beam or exposure to specular reflections. Proper eyewear must be worn at all times when operating. VCSEL Chip in the modules are electrostatic-sensitive device and proper ESD protection is required forhandling.
