Vertilite offers VCSEL chips on submount, surface-mount , TO can, and any heatsink or package that customers provides or requested. In-house packaging & testing technology for sampling, small volume ordering, and requirement servicing are available. Vertilite also houses dedicated foundry operations for chip bonding, wire bonding, optical packaging, and testing to meet the cost effective, high-volume requirements of our customers.

Figure 1. VCSELs in TO can with MPD (left), array on PLCC (middle), and on ceramic base (right).

Figure 2.  One-Watt module design with optical diffuser for time-of-flight (TOF) application (left), projection on object (middle), and 3D far field profile (right).